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ZSH低温真空焊接(烧结)设备

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Introduction
Features
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Specifications
Pipe fittings

广泛用于各种电子元器件芯片组装及封装工艺中,如MCM技术中的LTCC基板芯片与衬垫的真(气体保护)钎焊(烧结)(主要为HLSnPb39、HLSnPb56、HLAgPb97等)。

Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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ZSH低温真空焊接(烧结)设备