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ZSH-300低温真空焊接(烧结)设备

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Introduction
Features
Field
Specifications
Pipe fittings

该设备主要用于M E M S(微机电系统)器件焊接封装、电子管芯与基板焊接、电子基板与管壳焊接、元器件封焊、气密性管壳封焊、三微封装等方面。

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暂未实现,敬请期待
暂未实现,敬请期待
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ZSH-300低温真空焊接(烧结)设备